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DEPARTMENT OF ELECTRONIC & COMPUTER ENGINEERING
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HKUST
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DEPARTMENT OF ELECTRONIC & COMPUTER ENGINEERING
Menu
Introduction
Message from Department Head
Mission and Core Values
About ECE
Programs
Overview
Undergraduate Programs
BEng (ELEC)
BEng in Microelectronics and Integrated Circuits (MEIC)
BEng (CPEG)
BEng & BBA (EEGBM)
Postgraduate Programs
PhD in ECE
MPhil in ECE
MSc (ELEG)
MSc (IC)
MSc (Telecom)
Student Highlights
PG Intranet
Enrichment
Academic Advising (ELEC2910/3910)
Final Year Project/Thesis (ELEC4900/4901)
Co-op Program (ELEC4910)
Exchange Programs
Undergraduate Research
Internship Program (ELEC2991)
Internship Program (ELEC2992 for MEIC)
Admissions
Undergraduate Programs
Postgraduate Programs
PhD Early Admissions Scheme
People
Faculty
Recognitions
Admin & Technical Staff
Research
Research Areas
Multi-disciplinary Themes
Research Facilities
Books Published
Students
Careers
Networking
Industry Day 2024
Alumni
Accomplishment
Updates
Alumni Association
Stay Connected
Facebook
LinkedIn
QAE
ECE Advisory Board
UG Curriculum Committee
UG Student Affairs Committee
UG Staff-Student Liaison Committee
PG Committee
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Safety
News & Events
News
Events
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Join Us
School of Engineering
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Home
News
2022
2022
Faculty Achievement
Prof. FAN Zhiyong won the inaugural Bank of China (Hong Kong) Science & Tech Innovation Prize 2022 in the new materials category for his invention of the 3D artificial eye
Department News
2022 ECE Alumni Gathering on 17 Dec 2022
Department News
30th Congregation & Graduation Dinner on 1 Dec 2022
Department News
ECE Lab Tour on 2 Dec 2022 - CKSRI
Faculty Achievement
Prof. Ling SHI Named a 2023 IEEE Fellow
Faculty Achievement
Award Winning Work at ECE/HKUST Improves Human-robot Collaboration
Faculty Achievement
Prof. FAN Zhiyong Named a 2023 Optica Fellow
Department News
ECE Lab Tour on 9 Nov 2022
Faculty Achievement
Prof. Vladimir CHIGRINOV has become a member of EU Academy of Sciences (EUAS) since 2017
Department News
Prof. Johnny Kin On SIN was interviewed by the China Central Television (CCTV) introducing semiconductor chips development in China
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